Saturday Dec 14, 2024
Saturday Dec 14, 2024
Wednesday, 21 June 2017 00:00 - - {{hitsCtrl.values.hits}}
The Institution of Engineers, Sri Lanka (IESL), the apex body for the engineering profession in Sri Lanka, proudly announces the launch of Techno Sri Lanka – 2017, the national engineering and technology exhibition, its flagship event, to be held for its 32nd consecutive year on 13, 14 and 15 October at the BMICH.
The best of its kind to be held in Sri Lanka, the event is a beacon for the transfer of technology towards scientific and technological excellence of the profession and related industry in the country.
Each year since its inauguration in 1985 the event has brought forth the latest in technologies, products, skills and best practices from the world over to its target audience while maintaining optimum standards both in quality and quantity.
Being the largest one-stop exhibition related to engineering and technology, Techno Sri Lanka completed its 31st consecutive event last year with nearly 50,000 visitors. It has become the most preferred venue for industry professionals, business heads, technologists and keen public to come together on a single global platform.
The President Elect of IESL and Chairperson of the Organising Committee for Techno Sri Lanka 2017, Eng. (Prof.) Niranjanie Ratnayake explaining this year’s exhibition theme; ‘Empowering Innovation’ with the tagline ‘Smart, Inventive, Disruptive Technologies for Sustainable Development’ expressed the following sentiments: “The world is changing; engineers are in the forefront of this change. Expectations are very high in today’s society. However, the planet’s resources are fast depleting and engineers have to be smart and innovative to achieve high goals with very low resource consumption. Technology should reach the masses and make them do things differently, as doing ‘business as usual’ will not leave a healthy planet for our children and grandchildren. We need ‘disruptive technologies’ that will revolutionise the day-to-day activities, such as mobile technology, nanotechnology, household solar PV technology and perhaps other inventions and breakthroughs to satisfy the society’s expectations and still not be blamed by our future generations for not leaving them a liveable Planet Earth.”
In keeping with its theme; ‘Empowering Innovation’ this year’s exhibition will introduce several competitions that will encourage and promote smart, inventive, disruptive technologies among the younger generation. The Young Members Sections of the IESL is coming out with a bang collaborating with the private sector and the universities to organise an array of seven competitions lined up along this line for the event;
The objective of the competition is to promote innovation through smart solutions among university students and young engineers. The popular and cost-efficient Raspberry Pi platform will be used as the core of each product in the competition.
The competition is in two categories namely Undergraduate category and member category. Engineering undergraduates with IESL student membership can compete under the Undergraduate category. Corporate & non-corporate members of IESL who are below 35 years of age can compete under the Member category.
This is a team competition. Each team shall comprise three members. Initially, the competitors have to submit a proposal of their job. The proposal shall be a solution for a problem within Sri Lanka. Selected 30 teams will be given RaspberryPi 3 kits to continue their project.
Furthering its vision of building brighter futures for Sri Lanka, INSEE Cement formerly known as Holcim Cement 4th consecutive year partnered with the state engineering universities of university of Moratuwa, Peradeniya, Ruhuna, Jaffna, South Eastern and Open University of SL to conduct an innovative concrete mix design competition for the final year civil engineering students.
Awards for winners:
1st place – Thailand tour for 4 days (3 nights) (educational + entertainment)
2nd place – Stay in RIU, Ahungalla hotel (2 nights) (educational + entertainment)
3rd place – Stay in Chaaya tranz, Hikkaduwa hotel (1 night) (educational + entertainment)
The Faculty of Engineering, South Eastern University of Sri Lanka in collaboration with the YMS of the IESL is organising the first ever Unmanned Aerial Vehicle Challenge for engineering undergraduates in Sri Lanka. DroneX Challenge will be held at IESL’s TECHNO Exhibition this year.
The competition is open for all engineering students in Sri Lanka. A team may consist of up to five members. The drone shall complete a predefined circuit path consisting of ten GPS points in the shortest time. The circuit length shall be 750 metres. The drone shall complete the task on its own – automated, including landing and take-off.
IESL-YMS Hackathon is a gathering of innovators which help them to improve communication, learn new technologies, and share knowledge and to get priceless experiences. This is an event for undergraduates to introduce a solution to an existing problem in the world with their knowledge in the software field. Any state or private university student can register and take part in the competition.
The IESL Students Chapter of the Faculty of Engineering, University of Jaffna has planned to conduct a competition among engineering faculties all over the country under the YMS section of the IESL.
Tic-Tac-Toe challenges students in engineering programs to design a robotic manipulator which can automatically play a simple modified version of Tic-Tac-Toe on a given board specified here in the proposal. The competition aims at cooperation of students from different engineering backgrounds. A wide knowledge in the electronic, computer and mechanical engineering fields will be required to successfully design and manufacture the required manipulator.
This competition is open for all Civil Engineering students and first year students. Maximum number of members of a group is six. Three teams from each university will be selected for the final competition. The bridges should be constructed only using the provided spaghetti and hot melt glue. No other materials are to be used to build the strongest spaghetti bridge from optimum quantity of spaghetti and glue.
The Young Members Section (YMS) of the Institution of Engineers Sri Lanka (IESL) in
Association with Department of Mechanical and Manufacturing Engineering, Faculty of Engineering, University of Ruhuna is organising a Computer Aided 3D Design (CAD) competition named ‘CAD EAGER 2017’, to stimulate undergraduates to develop design, intellectual, team work and presentation skills. It was held for the first time as an event in the TECHNO 2013 exhibition.
Then the event was held in 2014, 2015 and in 2016 for the second, third and fourth times respectively with enthusiastic participation of Engineering Students and now it has been planned to organise this event annually as a simultaneous event of the TECHNO Exhibition.
Other than the above, features like Building Clinic, Short Seminars, Car Clinic, Junior Inventors Area and Under Graduate Inventors Area will function regularly with much appeal from specified target groups as well as the general public visiting the exhibition
Ministry of Defence pavilion (tri-forces)
This unique feature will be the first ever, at an exhibition in Sri Lanka. The three armed forces under the Ministry of Defence, will exhibit their R & D exhibits at this pavilion. The visiting professionals as well as the general public will recognise the engineering, research and development strength of our own armed forces under this pavilion.
The Techno Sri Lanka 2017 would endeavour to strengthen the links between the suppliers of engineering products and services and the relevant government institutions, with a view to facilitating mutual awareness of their resources and potential in fulfilling their needs, objectives and aspirations
For further clarifications and/or stall reservations, please contact the Techno Secretariat on 0115367315/ Malith Kannangara, Manager Operations Sales and Marketing – 0777771005. E-mail: [email protected]/Jiffry Farzandh, Manager Publicity – 0711094393/ E-mail: [email protected].
